Earlier this week, Apple introduced its long-awaited iPhone Air, featuring an ultra-thin body. The promotional images shared during the launch created the impression that Apple had achieved this slim profile by moving all logic board components into the protruding camera island. However, recently leaked schematics reveal that this is not entirely accurate.
Well-known leaker ShrimpApplePro shared detailed design diagrams showing that the A19 Pro chip occupies significantly more space than initially assumed. To maximize efficiency, Apple has adopted a “sandwich” style dual-sided layout, stacking components on both sides of the board. Key elements such as the C1X 5G modem and the N1 wireless communication chip are also distributed across both layers, reflecting Apple’s strategy of optimizing internal space with in-house chip solutions.
Not Fully Confined to the Camera Island
Despite Apple’s progress in miniaturization, the entire PCB could not be squeezed into the camera module. A drawing shared by @BasQuxFoo on X illustrates how the logic board sits within the device, making it clear that only the A19 Pro resides in the camera bump, while other components are positioned throughout the chassis.
A Glimpse Into the Future
Industry observers note that in future iterations, Apple may succeed in shrinking the logic board even further, eventually fitting all components within the camera cluster and freeing up room for much larger batteries. Still, to confirm the exact structure, enthusiasts will have to wait for upcoming teardown videos, which will provide the definitive answer.